About Faseen Co., Ltd.
Founded in 1996 in Shenzhen, Guangdong Province, China, Faseen Co., Ltd. operates three state-of-the-art production bases specializing in high-precision double-sided PCBs, multilayer PCBs, and complete PCB Assembly (PCBA). We serve clients worldwide with rapid prototyping, full-scale mass production, and fast delivery turnaround.
End-to-End Electronics Manufacturing & Engineering Solutions
Proven engineering expertise bridging initial hardware concept, rapid prototyping, and automated volume assembly.
Industry Solutions
Our solutions power critical applications across communications, computing, medical devices, consumer electronics, and the automotive industry. As a full-service, customer-centric provider, we have established a proven track record as a reliable, long-term partner in global manufacturing.
Quality & Standard Compliance
Certified to ISO 9001, ISO 14001, and UL standards, we enforce a strict quality control framework covering Technology, Training, Quality, and Service. This enables high-volume capacity, exceptional product reliability, on-time delivery, and competitive pricing.
Turnkey Development
We aim to build mutually beneficial relationships by solving complex engineering challenges. With our in-house embedded R&D division, we support the entire product lifecycle—transforming your initial hardware idea into pre-series prototypes or full production runs under one roof.
Strategic Global Footprint & Logistics Hubs
Dual operational facilities positioned directly at the crossroads of global electronics manufacturing and international trade corridors.
Shenzhen Quality & Engineering Center
12th Floor, ShanHai Creative Park, Jihua Road No. 503, Bantian, Longgang, Shenzhen, China, 518129
Located in the heart of the world's electronics supply chain. Houses our advanced quality inspection laboratory, staffed by senior test engineers and certified IPC-A-610 specialists.
- Full optical, chemical, X-ray, and solderability test line
- Direct daily access to authorized regional semiconductor fabs
- Immediate rapid-turn PCB factory coordination
Hong Kong Free-Port Logistics Center
Our tax-free international logistics hub enables frictionless worldwide shipping, same-day air freight consolidation, and secure temperature-controlled storage.
- Direct express connections via DHL, FedEx, UPS, and air cargo
- Constant temperature & humidity clean dry-storage
- Customs documentation & export compliance handling
In-House Quality & Anti-Counterfeit Laboratory
State-of-the-art diagnostic instruments dedicated to verifying component authenticity, packaging integrity, and electrical reliability before shipment.
High-Resolution X-Ray Inspection System
Non-destructive internal structural examination verifying silicon die dimensions, wire bonding integrity, and detecting counterfeit empty packages or broken bond wires.
Resolution: 0.5µm
Automated Optical Inspection (AOI)
High-speed multi-angle optical scanning for component coplanarity, lead pitch verification, and automated top-surface laser marking OCR recognition.
Speed: 400 parts/min
Metallurgical High-Power Microscope
Magnification up to 1000x for inspecting package surface texture, sanding scratches from remarking, pin oxidation, and lead plating uniformity.
Magnification: 40x - 1000x
Chemical Acid Decapsulation Unit
Precision nitric/sulfuric acid etching to expose the internal silicon die, validating original manufacturer logos, part numbers, and mask revision codes.
DPA Analysis Standard
Automated Solderability Test Bath
Evaluates component lead wettability and solder coverage according to MIL-STD-202 Method 208 and J-STD-002 to prevent SMT cold soldering.
Standard: MIL-STD-202
Heated Chemical Scrape Station
Detects resurfaced blacktopping and counterfeit markings via heated solvent exposure and mechanical scrape tests per IDEA-STD-1010-B.
Anti-Blacktopping Assay
Digital IC Parametric Analyzer
Curve tracing of input protection diodes, logic threshold measurement, leakage current verification, and pin-to-pin impedance profiling.
V/I Curve Analysis
Environmental Stress Chamber
Simulates extreme operating conditions with thermal shock cycling (-50°C to +150°C) and constant relative humidity aging up to 98% RH.
Range: -50°C to +150°C
Anti-Static Vacuum Sealing Line
ESD-safe carrier tape repacking, humidity indicator card insertion, desiccant pouch sealing, and nitrogen-purged vacuum heat sealing.
J-STD-033 MSL Standard6-Step End-to-End Quality Inspection Pipeline
A systematic, documented protocol executed for every lot number arriving at our logistics centers before customer release.
Documentation & Barcode Match
Manufacturer label verification, 2D DataMatrix scanning, purchase order traceability validation, and lot number factory confirmation.
Packaging & ESD Integrity Check
Moisture barrier bag inspection, humidity indicator card (HIC) check, desiccant integrity, and anti-static surface resistivity testing.
Optical & Marking Permanency
High-power optical microscopy checking pin coplanarity, mold indentations, and acetone scrape testing to detect blacktopped resurfacing.
Non-Destructive X-Ray Inspection
Internal silicon die size verification, wire bond layout mapping, and frame structure comparison against authorized golden samples.
Solderability & Curve Tracing
Dip-and-look solderability bath testing per MIL-STD-202, plus digital curve tracing to verify input/output diode threshold voltages.
CoC Certification & Dispatch
Issuance of a formal Certificate of Conformance (CoC), tamper-evident vacuum sealing, and dispatch via express international air freight.
Certified to Global Manufacturing & Environmental Standards
Adhering strictly to international quality management, environmental safety, and electronic assembly standards.
Schedule an On-Site or Virtual Facility Audit
We welcome QA managers and procurement auditors to inspect our Shenzhen laboratory, testing instruments, and documentation workflows.